Domain
Packaging Engineering
Packaging engineers design substrates, interconnects and thermal solutions — increasingly the key differentiator with 2.5D/3D and chiplets.
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Daily work
- Package design and stack-up
- Thermal and warpage simulation
- Assembly process development
- Reliability testing
Required skills
- Package types (FCBGA, WLCSP, SiP)
- Thermal/mechanical simulation
- Materials
- Reliability standards
Career roadmap
- Materials & assembly
- Package types
- Thermal analysis
- Advanced packaging
Future scope
Chiplets and India's ATMP investments make this one of the fastest-growing areas.
Learning path for Packaging Engineering
Beginner roadmap
- Assembly basics
- Substrate design
- Thermal modelling
- Reliability
Recommended books
- Microelectronics Packaging Handbook — Tummala
Practice projects
- Thermal model of a BGA package
- Chiplet interconnect study